bas316ws 200mw, high-speed switching smd diode small signal diode ? fast switching device(t rr <4.0ns) ? surface device type mounting ? moisture sensitivity level 1 ? matte tin(sn) lead finish ? pb free version, rohs compliant min max min max ? case : flat lead sod-323f small outline plastic package 1.15 1.40 0.045 0.055 2.30 2.80 0.091 0.106 0.25 0.40 0.010 0.016 1.60 1.80 0.063 0.071 0.80 1.10 0.031 0.043 0.05 0.15 0.002 0.006 package sod-323f sod-323f maximum ratings and electrical characteristics maximum ratings 1 usec 1 msec operating junction temperature t j 150 c notes: 1. the suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary despending on application. ordering information part no. packing t stg 200 e c a f d ? terminal: matte tin plated, lead free., solderable per mil-std-202, method 208 guaranteed unit (mm) unit (inch) dimensions b sod-323f features mechanical data a power dissipation 250 ? green compound (halogen free) with suffix "g" on packing code and prefix "g" on date code ? high temperature soldering guaranteed: 260 c/10s bas316ws rr 3kpcs / 7" reel ? polarity : indicated by cathode band ? weight : 4.60.5 mg ? marking code : w2 pin configuration non-repetitive peak forward surge current pulse width= 4.0 bas316ws rrg 3kpcs / 7" reel i fsm 1.0 suggested pad layout units value symbol rating at 25 c ambient temperature unless otherwise specified. type number dimensions unit (mm) x 0.710 storage temperature range average forward current mw i o p d pulse width= c -65 to + 150 ma x 1 2.900 y 0.403 x 1 y (2x) x (2x) version : a10
bas316ws 200mw, high-speed switching smd diode small signal diode electrical characteristics i r = 100 ua i f = 1.0 ma i f = 10 ma i f = 50 ma i f = 150 ma v r = 75 v v r = 25 v junction capacitance v r = reverse recovery time i f =i r = tape & reel specification dimension(mm) note 1: a0, b0, and k0 are determined by component size. the clearance between the components and the cavity must be within 0.05 mm min. to 0.5 mm max. the component cannot rote more than 10o within the determined cavity. note 2: if b1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders. w1 14.4 max. overall tape thickness t 0.6 max. tape width reel width w 8.30 max. sprocke hole position punch hole position sprocke hole pitch embossment center p1 3.50 0.05 4.00 0.10 2.00 0.10 f p0 sprocket hole reel outside diameter reel inner diameter feed hole width item carrier depth 2.40 max. 1.50 +0.10 d symbol k 0.855 e d2 178 1 50 min. 13.0 0.5 1.75 0.10 a d1 v f 0.715 max units v v - min - - type number symbol 1.000 - 1.250 forward voltage reverse breakdown voltage v (br) 100 - reverse leakage current i r - 1.00 ua 0.03 0, f=1.0mhz c j - 1.5 pf ns 10ma, irr=0.1 x i r , trr - 4.0 top cover tape carieer tape any additional label (if required) tsc label w1 d1 d2 a ersion : a10 version : a10
bas316ws 200mw, high-speed switching smd diode small signal diode rating and characteristic curves fig 1 typical forward characteristics 0 25 50 75 100 125 150 175 200 225 250 275 300 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 instantaneous forward current (ma) fig 3 admissible power dissipation curve 0 50 100 150 200 250 0 25 50 75 100 125 150 175 power dissipation (mw) fig 4 typical junction capacitance 0 0.2 0.4 0.6 0.8 0246810121416 junction capacitance (pf) ta=25c ambient temperature (c) reverse voltage (v) ta=25c fig 2 reverse current as a function of junction temperature. 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 160 180 200 reverse current (ua) vr=75v max junction temperature ( o c) instantaneous forward voltage (v) vr=75v typ typ vr=25v version : a10
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